The Wafer Sorter mWS 150 / 200 is designed for sorting,(mass)transfering,splitting or merging of 150mm(6”)and 200mm(8”)thin and warped wafers in one machine and can be equipped with up to six cassettes.The mWS 150 / 200 continuously monitors all wafers in the cassette before and during the whole work process and verifies the compatibility of wafer and end - effector size.
The mWS 150 / 200 comes with two scanners(each for up to three cassettes),a dual - arm - robot,Bernoulli vacuum end - effectors,a pre - aligner and an automated end - effector change station,as well as an end - effector cleaner.Optionally it can be equipped with other end - effectors(e.g. Top Grip or Batch)and a green light visual inspection module.
Features
• Wafer sizes:150mm(6”)and 200mm(8”) • Sorting of two wafer sizes in one machine • Handling of warped wafers • Optimized footprint • Automated changing and cleaning of end - effectors • Green light visual inspection optional • OCR reader for wafer ID optional • FFU for better cleanroom class optional • Cleanroom class 5(ISO EN 14 644 - 1) • CE certificated • SEMI standards compliant • UPS(uninterruptible power supply)optional