The Packing Tool mPT 150 / 200 is designed for packing and unpacking of 150mm(6”)and 200mm(8”)wafers by using contactless end - effectors(mCL series).
The mPT 150 / 200 comes with a dual - arm - robot,contactless end - effectors for 6" / 8" wafers,wafer flipping function,two cassette stations with scanner for 6" / 8" cassettes,a pre - aligner,a packing chuck and a packing module containing five stations for shipping boxes and packing material,as well as a touch screen.Optionally it can be equipped with a green light visual inspection module.
Features
• Wafer sizes:150mm(6”)and 200mm(8”) • Packing and unpacking of e.g.thin - wafers • Handling of warped wafers • Optimized footprint • High throughput • Cassette scanning • Green light visual inspection optional • OCR reader for wafer ID optional • FFU for better cleanroom class optional • Cleanroom class 6(ISO EN 14 644 - 1) • CE certificated • SEMI standard compliant • UPS(uninterruptible power supply)optional